Efficient on-chip hotspot removal combined solution of thermoelectric cooler and mini-channel heat sink
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چکیده
منابع مشابه
Effect of conjugate heat transfer in designing thermoelectric beverage cooler
Peltier technology opens new opportunities for special applications. In the current project, this technology was applied to design and fabricate a portable thermoelectric beverage cooler and thermoelectric cup. The simulation and results of the experiment showed that the common beverage cooler is not a suitable design for ignoring the effect of natural convection in cooling. In our thermoel...
متن کاملEffect of conjugate heat transfer in designing thermoelectric beverage cooler
Peltier technology opens new opportunities for specialapplications. In the current project, this technology was appliedto design and fabricate a portable thermoelectric beveragecooler and thermoelectric cup. The simulation and results of theexperiment showed that the common beverage cooler is not asuitable design for ignoring the effect of natural convection in<br ...
متن کاملeffect of conjugate heat transfer in designing thermoelectric beverage cooler
peltier technology opens new opportunities for specialapplications. in the current project, this technology was appliedto design and fabricate a portable thermoelectric beveragecooler and thermoelectric cup. the simulation and results of theexperiment showed that the common beverage cooler is not asuitable design for ignoring the effect of natural convection incooling. in our thermoelectric cup...
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Title of Dissertation: On-Chip Thermoelectric Cooling of Semiconductor Hot Spot Peng Wang, Doctor of Philosophy, 2007 Directed By: Professor Avram Bar-Cohen Assistant Professor Bao Yang Department of Mechanical Engineering The Moore’s Law progression in semiconductor technology, including shrinking feature size, increasing transistor density, and faster circuit speeds, is leading to increasing ...
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A suspended, planar multistage micro thermoelectric (TE) cooler is designed using thermal network model to cool MEMS devices. Though the planar (two-dimensional) design is compatible with MEMS fabrication, its cooling performance is reduced compared to that of a pyramid (three-dimensional) design, due to a mechanically indispensable thin dielectric substrate (SiO2) and technical limit on TE fil...
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ژورنال
عنوان ژورنال: Applied Thermal Engineering
سال: 2016
ISSN: 1359-4311
DOI: 10.1016/j.applthermaleng.2016.01.131